TSMC Unveils Revolutionary Chip Technology for AI Era
Taiwan Semiconductor Manufacturing Company (TSMC) has announced plans for its next-generation chip technology and advanced packaging system to support growing demand from artificial intelligence workloads. The company is set to launch its A14 process in 2028, which promises significant performance upgrades while reducing power consumption. TSMC’s ‘System on Wafer-X’ platform will enable the integration of at least 16 large computing chips into one interconnected system, addressing the intense processing needs of AI applications. This shift marks a key change in semiconductor manufacturing priorities from focusing solely on chip speed to multi-chip scaling and integration.
This news summary was generated based on an article originally reported by BW Businessworld.
